METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON SUBSTRATES

METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON SUBSTRATES

Described is a method of forming a metal or metal alloy layer onto a substrate comprising the following steps i) provide a substrate including a permanent resin layer on top of at least one contact area and a temporary resin layer on top of the permanent resin layer, ii) contact the entire substrate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SVEN LAMPRECHT, KAI-JENS MATEJAT, CATHERINE SCHOENENBERGER, JÜRGEN KRESS, INGO EWERT
Format: Patent
Sprache:eng ; por
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Described is a method of forming a metal or metal alloy layer onto a substrate comprising the following steps i) provide a substrate including a permanent resin layer on top of at least one contact area and a temporary resin layer on top of the permanent resin layer, ii) contact the entire substrate area including the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface and i) electroplate a metal or metal alloy layer onto the conductive layer.