A HEAT TREATED PACKAGE FORMED FROM FIBRE BASED PACKAGING MATERIAL
The invention relates to a package intended for thermal treatment comprising a fiber-based packaging material treated with a hydrophobic size and comprising one or more layers for reduced water penetration outside and/or inside the fiber substrate. The package of the invention is characterized by th...
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Format: | Patent |
Sprache: | eng ; por |
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Zusammenfassung: | The invention relates to a package intended for thermal treatment comprising a fiber-based packaging material treated with a hydrophobic size and comprising one or more layers for reduced water penetration outside and/or inside the fiber substrate. The package of the invention is characterized by the fiber substrate being treated with a combination of a wet-strength size, a hydrophobic size and an aluminum and/or calcium compound for increased heat resistance of the packaging material, and in that the ratio of hydrophobic size to the aluminium and/or calcium compound is 1:1-1:10. |
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