GOLD NICKEL ALLOY LAYER HAVING NITROGEN ATOMS INSERTED THEREIN AND RELATED PROCESSING METHOD

The current invention relates to a gold nickel layer comprising nitrogen inserted over a thickness equal to or greater than 0.20 μm, characterized in that the atomic concentration of gold is at least 15% over said thickness, the atomic concentration of nickel is at least 10% over said thickness and...

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Bibliographische Detailangaben
Hauptverfasser:	LANGER, LUC, MONTEVERDE, FABIEN, GODFROID, THOMAS, RENAUX, FABIAN
Format:	Patent
Sprache:	eng ; pol
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The current invention relates to a gold nickel layer comprising nitrogen inserted over a thickness equal to or greater than 0.20 μm, characterized in that the atomic concentration of gold is at least 15% over said thickness, the atomic concentration of nickel is at least 10% over said thickness and the atomic concentration of nitrogen is at least 5% over said thickness. The invention further relates to a process for treating a gold nickel layer. The invention also relates to a connector comprising a portion of a surface which comprises such a gold nickel layer.