CLOSED-LOOP ADJUSTMENT SYSTEM AND METHOD FOR GAP CONTROL AND LEVELING OF ULTRASONIC DEVICES

An apparatus (10) for forming bonds on a web incudes an anvil (14), a bonding device (12) positioned adjacent the anvil (14) and configured to interact with the anvil (14) to form the bonds on the web, and an actuator (32) that enables adjustment of an orientation between the bonding device (12) and...

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Bibliographische Detailangaben
Hauptverfasser:	SCHUETTE, DAVID E, LAFFERTY, JUSTIN M
Format:	Patent
Sprache:	eng ; pol
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An apparatus (10) for forming bonds on a web incudes an anvil (14), a bonding device (12) positioned adjacent the anvil (14) and configured to interact with the anvil (14) to form the bonds on the web, and an actuator (32) that enables adjustment of an orientation between the bonding device (12) and the anvil (14). The apparatus (10) also includes a closed-loop control system (16) configured to control operation of the actuator (32), the closed-loop control system (16) configured to monitor an operational parameter of the assembly (10) indicative of interaction of the bonding device (12) with the anvil (14), determine whether the bonding device (12) is parallel or substantially parallel with the anvil (14) based on the operational parameter and, when the bonding device (12) is not parallel or substantially parallel with the anvil (14), cause the actuator (32) to adjust the orientation between the bonding device (12) and the anvil (14).