A LAMINATE HAVING A BASE MATERIAL AND AN ADHESIVE LAYER

Problem: To provide a resin composition that has excellent adhesiveness to bare copper, is capable of retaining adhesiveness to bare copper even when exposed to a hot and humid environment for a long period of time, and enables compliance to standards for high rated temperatures or accreditation to...

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Bibliographische Detailangaben
Hauptverfasser:	INOMATA, SAYURI, ZENNYOJI, YOSHIHIRO
Format:	Patent
Sprache:	eng ; pol
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	Problem: To provide a resin composition that has excellent adhesiveness to bare copper, is capable of retaining adhesiveness to bare copper even when exposed to a hot and humid environment for a long period of time, and enables compliance to standards for high rated temperatures or accreditation to the standards to be achieved without involving a cross-linking step, and to provide a laminate that can be suitably used as a covering material for flexible flat cables in which the resin composition is used.Solution: A resin composition for an adhesive layer of a laminate, the resin composition, containing: (A) 55 to 85 mass% of an acid modified polypropylene-based resin; and (B) 45 to 15 mass% of a copolymer of ethylene and one or more comonomers selected from the group consisting of vinyl acetate, an alkyl methacrylate, and an alkyl acrylate; in which the total of the component (A) and the component (B) is 100 mass%; and in which an acid modified amount of the component (A) is 0.5 to 10 mol%.