LASER INDUCED STRUCTURAL MODIFICATION OF PAPERBOARDS

A method for locally modifying a structure of a paperboard. A penetrating region (114) of the paperboard (110) is penetrated by laser radiation (102) such that moisture in the penetrating region (114) evaporates for locally modifying the structure of the penetrating region (114) e.g. by weakening th...

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Bibliographische Detailangaben
Hauptverfasser:	VAUCHER, SÉBASTIEN, WASMER, KILIAN, EQUIS, SÉBASTIEN, HOFFMANN, PATRIK, PILLONEL, GILLES
Format:	Patent
Sprache:	eng ; pol
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN AMANNER ANALOGOUS TO PAPER MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD ORMATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER
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Beschreibung
Zusammenfassung:	A method for locally modifying a structure of a paperboard. A penetrating region (114) of the paperboard (110) is penetrated by laser radiation (102) such that moisture in the penetrating region (114) evaporates for locally modifying the structure of the penetrating region (114) e.g. by weakening the paperboard at the region and for deforming it there.