DEVICE AND METHOD FOR MONITORING, MORE PARTICULARLY CONTROLLING, A CUTTING PROCESS

The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SCHINDHELM, DAVID, REEGARD, BORIS
Format: Patent
Sprache:eng ; pol
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Beschreibung
Zusammenfassung:The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An evaluation apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.