DEVICE COVER FOR THERMAL MANAGEMENT

An electronic device includes a cover for one or more heat generating components, with the cover providing at least a combined conductive, convective, and radiant cooling for the heat generating components while maintaining the device within a prescribed temperature range. Conductive cooling is realized by providing thermal coupling between each of two or more depression regions in the cover and one or more heat generating components. Appropriate placement of air inlets and outlets through the cover provides convective cooling of the heat generating components and the thermally coupled depression regions. Heat from the heat generating components thermally coupled to one depression region is effectively isolated from heat generated by other heat generating components thermally coupled to another adjacent depression region at least in part via the air outlets through an interior region between the two adjacent depression regions. Radiant cooling can also be improved by increasing the emissivity of the device cover material.