POLYAMIDE RESIN COMPOSITION AND HOLLOW MOLDED BODY CONTAINING SAME

Provided are a composition having flexibility, a breaking pressure resistance, a low-temperature impact resistance, an environmental resistance, and a chemical resistance, which are at least equivalent to those of PA 12, and exhibiting excellent moldability and processability when a molded article i...

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Bibliographische Detailangaben
Hauptverfasser: KUBO, TSUYOSHI, OKAMURA, SHIGEKAZU, FUJII, HIROAKI, KATAYAMA, NAOYA
Format: Patent
Sprache:eng ; pol
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Zusammenfassung:Provided are a composition having flexibility, a breaking pressure resistance, a low-temperature impact resistance, an environmental resistance, and a chemical resistance, which are at least equivalent to those of PA 12, and exhibiting excellent moldability and processability when a molded article is produced from the composition, and a blow molded article using the same. A polyamide resin composition comprising a PA 6/12 (component A), a plasticizer (component B), and a modified polyolefin (component C), the component A comprising units a derived from µ-caprolactam or µ-aminocaproic acid and units b derived from aminododecanoic acid or É-laurolactam, wherein the content of the units a in the units constituting the component A is 60 to 98% by weight and the content of the units b in the units constituting the component A is 40 to 2% by weight, wherein the content of the component A in the polyamide resin composition is 50 to 98% by weight, the content of the component B in the polyamide resin composition is 20 to 1% by weight, and the content of the component C in the polyamide resin composition is 30 to 1% by weight.