MULTILAYER FILM FOR RESEALABLE PACKAGING
The invention relates to: 1) a multilayer film including a layer having a thickness of between 7 and 300 µm and consisting of a hot-melt pressure-sensitive adhesive composition having an MFI of 0.01 to 100 g/10 minutes, said composition including: 40% to 70% of an SIS styrene block copolymer mixture...
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Format: | Patent |
Sprache: | eng ; pol |
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Zusammenfassung: | The invention relates to: 1) a multilayer film including a layer having a thickness of between 7 and 300 µm and consisting of a hot-melt pressure-sensitive adhesive composition having an MFI of 0.01 to 100 g/10 minutes, said composition including: 40% to 70% of an SIS styrene block copolymer mixture having a styrene content of 10% to 16% and a diblock copolymer content of 50% to 90%; and 30% to 60% of one or more tackifying resins having a softening temperature of between 5ºC and 140ºC; 2) a method for manufacturing said film by means of coextrusion; and 3) the use of said film for manufacturing resealable cartons. |
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