ADHESIVE COMPOSITION WITH INCREASED CURE RATE

Adhesive composition consisting of an aminoplast resin with a free formaldehyde-like compound being present. In particular an adhesive composition consisting of a melamine-urea-formaldehyde resin to which a free formaldehyde-like compound has been added so that F/(NH2)2 is equal to 0.8-1.6. The adhe...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MATTHEIJ JOZEF MARIA JOHANNES, VAN DER WAALS ADRIAAN CORNELIS LAMBERTUS MARIA, OOSTING GERARD EVERT
Format:	Patent
Sprache:	eng ; pol
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASTING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES FOUNDRY MOULDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUTORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTINGOF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NAILING OR STAPLING MACHINES IN GENERAL NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES POWDER METALLURGY SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL
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Beschreibung
Zusammenfassung:	Adhesive composition consisting of an aminoplast resin with a free formaldehyde-like compound being present. In particular an adhesive composition consisting of a melamine-urea-formaldehyde resin to which a free formaldehyde-like compound has been added so that F/(NH2)2 is equal to 0.8-1.6. The adhesive is in particular suitable for the preparation of board material by combining in a press cellulose-containing materials with the adhesive according to the invention and in this press manufacturing board material at elevated temperature and pressure.