Method of direct metal plating of dielectrics, especially walls of printed circuit openings

1. The method of direct metal plating of dielectrics, especially walls of printed circuit openings consists in subjecting them to initial processing and activation by depositing an adsorptive coating of a metallic activator of electrochemical metal plating. Unique characteristics: A metallic layer is deposited in electrolytic bath containing ions of metals, with the normal potential under -0.5 V, preferably -0.75V, with respect to a calomel electrode, or ions of metals subjected to complex formation with ammonia or pyrophosphate ions, or with organic compounds, containing at least three hydroxyl groups or amino and carboxyl groups, so that the deposition potential of the ions of the metal subjected to complex formation is below -0.5V, preferably -0.75V, with respect to the saturated calomel electrode.