FLUX FOR SOLDER PASTE AND SOLDER PASTE
Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass pcnt . The flux also co...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass pcnt . The flux also contains 0-20 mass pcnt of a block organic acid and 0-3 mass pcnt of an activator. |
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