FLUX FOR SOLDER PASTE AND SOLDER PASTE

Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass pcnt . The flux also co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HAYASHIDA Toru, HORIKOSHI Rina
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass pcnt . The flux also contains 0-20 mass pcnt of a block organic acid and 0-3 mass pcnt of an activator.