SILICONE-BASED ADHESIVE SHEET, MULTILAYER STRUCTURE INCLUDING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

[Problem] To provide a silicone-based adhesive sheet which has a slightly tacky surface and is hence capable of easily temporarily fixing, for example, semiconductor chips obtained by dicing to a semiconductor base and which comes to exhibit permanent adhesiveness to the adherent upon post-curing; a...

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Bibliographische Detailangaben
Hauptverfasser:	SUTOH, Manabu, TODA, Nohno
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MICROSTRUCTURAL TECHNOLOGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	[Problem] To provide a silicone-based adhesive sheet which has a slightly tacky surface and is hence capable of easily temporarily fixing, for example, semiconductor chips obtained by dicing to a semiconductor base and which comes to exhibit permanent adhesiveness to the adherent upon post-curing; a multilayer structure including the silicone-based adhesive sheet; a semiconductor device obtained using the adhesive sheet; and a method for producing the semiconductor device. [Solution] A silicone-based adhesive sheet having a bonding surface which, before heating, can be separated from another non-tacky base in an interfacial-separation mode and which, upon heating at a temperature in the range of 50-200øC, changes in the mode of separation from the other non-tacky base to come to undergo a cohesive failure to exhibit permanent adhesiveness; a use of the silicone-based adhesive sheet as, for example, a die-attach film for semiconductors; and a semiconductor device, e.g., an MEMS device, which has a structure comprising a base and a semiconductor chip or semiconductor wafer fixed to the base by a cured layer obtained from the silicone-based adhesive sheet.