CURABLE RESIN FILM AND SHEET FOR FORMING A FIRST PROTECTIVE FILM

This curable resin film is a film which is for forming a first protective film on a surface of a semiconductor wafer by being adhered to the surface having bumps and by being cured, wherein the visible light transmittance of the curable resin film before curing is 45 pcnt or less, and the infrared r...

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Bibliographische Detailangaben
1. Verfasser:	YAMAGISHI Masanori
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	This curable resin film is a film which is for forming a first protective film on a surface of a semiconductor wafer by being adhered to the surface having bumps and by being cured, wherein the visible light transmittance of the curable resin film before curing is 45 pcnt or less, and the infrared ray transmission of the curable resin film before curing is 33 pcnt or more. This sheet for forming the first protective film is provided with a first supporting sheet, and said curable resin film on one surface of the first supporting sheet.