PRESSURE-SENSITIVE ADHESIVE TAPE FOR SEMICONDUCTOR SUBSTRATE FABRICATION

An adhesive tape 100 for processing semiconductor substrates according to the present invention is characterized by comprising a base material 4 and an adhesion layer 2 stacked on one surface of the base material 4, wherein the base material 4 includes a notch layer 41 positioned so as to form the o...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	NAGAO, Yoshinori
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An adhesive tape 100 for processing semiconductor substrates according to the present invention is characterized by comprising a base material 4 and an adhesion layer 2 stacked on one surface of the base material 4, wherein the base material 4 includes a notch layer 41 positioned so as to form the one surface side and an extension layer 42 stacked on the other surface to the notch layer 41, and the tack force of the extension layer 42 is 1-200 kPa at 80§C. Accordingly, the present invention can provide an adhesive tape for processing semiconductor substrates that, at a dicing step, enables inhibition or prevention of fusion of the extension layer to a dicer table while enabling unerring prevention of occurrence of curving.