LEAD-FREE SOLDER ALLOY, ELECTRONIC CIRCUIT SUBSTRATE, AND ELECTRONIC CONTROL DEVICE

The purpose of the present invention is to provide: a lead-free solder alloy with which progression of cracking in solder joints can be suppressed even in a rugged environment with severe differences between hot and cold and with a vibration load and, even when soldering is performed using electroni...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ARAI Masaya, KATSUYAMA Tsukasa, NAKANO Takeshi, HORI Atsushi, MUNEKAWA Yurika
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide: a lead-free solder alloy with which progression of cracking in solder joints can be suppressed even in a rugged environment with severe differences between hot and cold and with a vibration load and, even when soldering is performed using electronic components that do not have Ni/Pd/Au plating, progression of cracking in the vicinity of solder joints with electronic components can be suppressed; an electronic circuit board having solder joints formed using the lead-free solder alloy; and an electronic control device. To achieve this purpose, this led-free solder alloy is characterized by including 1 - 4 pcnt by weight Ag, 1 pcnt by weight or less Cu, 3 - 5 pcnt by weight Sb, and 0.01 - 0.25 pcnt by weight Ni, with the remaining portion being Sn.