RESIN AND PHOTOSENSITIVE RESIN COMPOSITION
Provided are: a resin which enables the achievement of a cured film having high degree of elongation, low stress and high metal adhesion; and a photosensitive resin composition. A resin (A) which has a polyamide structure and at least one of an imide precursor structure and an imide structure, and w...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MASUDA, Yuki SHOJI, Yu OKUDA, Ryoji ISOBE, Kimio |
| description | Provided are: a resin which enables the achievement of a cured film having high degree of elongation, low stress and high metal adhesion; and a photosensitive resin composition. A resin (A) which has a polyamide structure and at least one of an imide precursor structure and an imide structure, and which is characterized in that at least one of the structures of the resin (A) has a diamine residue having an aliphatic group. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_PH12018500669A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>PH12018500669A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_PH12018500669A13</originalsourceid><addsrcrecordid>eNrjZNAKcg329FNw9HNRCPDwD_EPdvUL9gzxDHNVgEg4-_sG-INE_P14GFjTEnOKU3mhNDeDiptriLOHbmpBfnxqcUFicmpeakl8gIehkYGhhamBgZmZpaOhMZHKAE9jJkA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RESIN AND PHOTOSENSITIVE RESIN COMPOSITION</title><source>esp@cenet</source><creator>MASUDA, Yuki ; SHOJI, Yu ; OKUDA, Ryoji ; ISOBE, Kimio</creator><creatorcontrib>MASUDA, Yuki ; SHOJI, Yu ; OKUDA, Ryoji ; ISOBE, Kimio</creatorcontrib><description>Provided are: a resin which enables the achievement of a cured film having high degree of elongation, low stress and high metal adhesion; and a photosensitive resin composition. A resin (A) which has a polyamide structure and at least one of an imide precursor structure and an imide structure, and which is characterized in that at least one of the structures of the resin (A) has a diamine residue having an aliphatic group.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181001&DB=EPODOC&CC=PH&NR=12018500669A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181001&DB=EPODOC&CC=PH&NR=12018500669A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MASUDA, Yuki</creatorcontrib><creatorcontrib>SHOJI, Yu</creatorcontrib><creatorcontrib>OKUDA, Ryoji</creatorcontrib><creatorcontrib>ISOBE, Kimio</creatorcontrib><title>RESIN AND PHOTOSENSITIVE RESIN COMPOSITION</title><description>Provided are: a resin which enables the achievement of a cured film having high degree of elongation, low stress and high metal adhesion; and a photosensitive resin composition. A resin (A) which has a polyamide structure and at least one of an imide precursor structure and an imide structure, and which is characterized in that at least one of the structures of the resin (A) has a diamine residue having an aliphatic group.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAKcg329FNw9HNRCPDwD_EPdvUL9gzxDHNVgEg4-_sG-INE_P14GFjTEnOKU3mhNDeDiptriLOHbmpBfnxqcUFicmpeakl8gIehkYGhhamBgZmZpaOhMZHKAE9jJkA</recordid><startdate>20181001</startdate><enddate>20181001</enddate><creator>MASUDA, Yuki</creator><creator>SHOJI, Yu</creator><creator>OKUDA, Ryoji</creator><creator>ISOBE, Kimio</creator><scope>EVB</scope></search><sort><creationdate>20181001</creationdate><title>RESIN AND PHOTOSENSITIVE RESIN COMPOSITION</title><author>MASUDA, Yuki ; SHOJI, Yu ; OKUDA, Ryoji ; ISOBE, Kimio</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_PH12018500669A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>MASUDA, Yuki</creatorcontrib><creatorcontrib>SHOJI, Yu</creatorcontrib><creatorcontrib>OKUDA, Ryoji</creatorcontrib><creatorcontrib>ISOBE, Kimio</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MASUDA, Yuki</au><au>SHOJI, Yu</au><au>OKUDA, Ryoji</au><au>ISOBE, Kimio</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN AND PHOTOSENSITIVE RESIN COMPOSITION</title><date>2018-10-01</date><risdate>2018</risdate><abstract>Provided are: a resin which enables the achievement of a cured film having high degree of elongation, low stress and high metal adhesion; and a photosensitive resin composition. A resin (A) which has a polyamide structure and at least one of an imide precursor structure and an imide structure, and which is characterized in that at least one of the structures of the resin (A) has a diamine residue having an aliphatic group.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_PH12018500669A1 |
| source | esp@cenet |
| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | RESIN AND PHOTOSENSITIVE RESIN COMPOSITION |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T14%3A11%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MASUDA,%20Yuki&rft.date=2018-10-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EPH12018500669A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |