RESIN AND PHOTOSENSITIVE RESIN COMPOSITION

Provided are: a resin which enables the achievement of a cured film having high degree of elongation, low stress and high metal adhesion; and a photosensitive resin composition. A resin (A) which has a polyamide structure and at least one of an imide precursor structure and an imide structure, and w...

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Bibliographische Detailangaben
Hauptverfasser:	MASUDA, Yuki, SHOJI, Yu, OKUDA, Ryoji, ISOBE, Kimio
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Provided are: a resin which enables the achievement of a cured film having high degree of elongation, low stress and high metal adhesion; and a photosensitive resin composition. A resin (A) which has a polyamide structure and at least one of an imide precursor structure and an imide structure, and which is characterized in that at least one of the structures of the resin (A) has a diamine residue having an aliphatic group.