PREMOLDED SUBSTRATE FOR MOUNTING A SEMICONDUCTOR DIE AND A METHOD OF FABRICATION THEREOF

A method of forming a premolded substrate for mounting a semiconductor die, comprising the steps of providing a carrier, forming conductive circuits on the carrier and forming a plurality of metallic contacts on the conductive circuits. Thereafter, the method further comprises encapsulating the carrier by compressing a top portion of each metallic contact to crush and flatten the top portion of each metallic contact, and introducing a molding compound to surround the plurality of metallic contacts such that the flattened top surfaces of the plurality of metallic contacts are exposed on and flush with a top surface of the molding compound.