COPPER FOIL, COPPER-CLAD LAMINATE BOARD, METHOD FOR PRODUCING PRINTED WIRING BOARD, METHOD FOR PRODUCING ELECTRONIC APPARATUS, METHOD FOR PRODUCING TRANSMISSION CHANNEL, AND METHOD FOR PRODUCING ANTENNA

To provide a copper foil and a copper-clad laminate board that have a good circuit formability and have a favourably suppressed transmission loss even in the use thereof in a high frequency circuit board. A copper foil comprising a gloss face, a surface roughness Ra of a surface of the copper foil o...

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Bibliographische Detailangaben
1. Verfasser:	FUKUCHI, Ryo
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	To provide a copper foil and a copper-clad laminate board that have a good circuit formability and have a favourably suppressed transmission loss even in the use thereof in a high frequency circuit board. A copper foil comprising a gloss face, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.25 mm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.10 mm or less measured with a laser microscope, wherein the copper foil has a layer structure after heating at 200degC for 30 minutes or after heating at 130degC for 30 minutes or after heating at 300degC for 30 minutes.