INTEGRATED VAPOR CHAMBER FOR THERMAL MANAGEMENT OF COMPUTING DEVICES

A vapor chamber may be integrated with one or more components of a computing device to provide thermal management. The vapor chamber may include upper and lower portions forming the vapor chamber, and an annular space between the upper and lower portions that includes a fluid. The vapor chamber may...

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Bibliographische Detailangaben
Hauptverfasser:	STELLMAN, TAYLOR, DELANO, ANDREW
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING PHYSICS WEAPONS
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Beschreibung
Zusammenfassung:	A vapor chamber may be integrated with one or more components of a computing device to provide thermal management. The vapor chamber may include upper and lower portions forming the vapor chamber, and an annular space between the upper and lower portions that includes a fluid. The vapor chamber may be configured to absorb heat from a heat source of the computing device. Subsequently, the uniform heat transfer may enable the external surfaces of the computing device to achieve substantially isothermal external surface conditions, which may maximize a power dissipation of the computing device for a given ambient temperature ensuring a temperature of the computing device remains at or below safe limits while in use.