WINDING STRUCTURE OF BONDING WIRE FOR SEMICONDUCTOR DEVICES

The present invention relates to a novel winding structure of a bonding wire, which is wound on a spool comprising a lead winding part in which the wire is regularly wound, a main winding part in which the wire is cross-wound in multilayers, and a tail winding part in which the wire is regularly wou...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ITO, Anna, MIKAMI, Michitaka, MAEDA, Nanako, CHEN, Wei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES PACKING PERFORMING OPERATIONS SEMICONDUCTOR DEVICES STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a novel winding structure of a bonding wire, which is wound on a spool comprising a lead winding part in which the wire is regularly wound, a main winding part in which the wire is cross-wound in multilayers, and a tail winding part in which the wire is regularly wound; wherein at least one of oblique sides of both end shapes of the main winding part has a protruding portion of an intermediate oblique side or an upper oblique side, the upper and/or intermediate oblique sides having elevation angles steeper than the elevation angle of a lower oblique side extending from the end of the spool; the protruding portion is continued to a wave-like zigzag layer; and the height of the peak of the upper oblique side is higher than the average height of the zigzag layer.