COPPER FOIL PROVIDED WITH CARRIER, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD

[Solution to Problem] The copper foil provided with a carrier is provided which can prevent an increase in release strength of a carrier foil after long-time high-temperature thermal history, and thus can stabilize the release strength. [Means for Solving Problem] A copper foil provided with a carri...

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Bibliographische Detailangaben
1. Verfasser:	AKITOSHI TAKANASHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
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Beschreibung
Zusammenfassung:	[Solution to Problem] The copper foil provided with a carrier is provided which can prevent an increase in release strength of a carrier foil after long-time high-temperature thermal history, and thus can stabilize the release strength. [Means for Solving Problem] A copper foil provided with a carrier includes a carrier foil, a release layer, and an ultra-thin copper foil disposed in this order. The release layer contains 5-carboxybenzotriazole (5CBTA) and/or 4-carboxybenzotriazole (4CBTA) and the ratio of the amount of deposited 5-carboxybenzotriazole to the amount of deposited 4-carboxybenzotriazole i.e., 5CBTA/4CBTA ratio, in the release layer is 3.0 or more.