Coupling element, coupling assembly with such a coupling element and method of coupling a first substrate to such a coupling element

The present invention proposes a coupling element comprising a coupling body (12) having a first joining surface (13), said coupling body (12) comprising a bonding material being weldable at a melting temperature. At least one heating element (50) is provided to heat the bonding material at a temper...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Teixeira Pinto, José Miguel, Julien, Olivier, Kleitz, Olivier, Renard, Paul Henri, Valleau, Aline
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention proposes a coupling element comprising a coupling body (12) having a first joining surface (13), said coupling body (12) comprising a bonding material being weldable at a melting temperature. At least one heating element (50) is provided to heat the bonding material at a temperature equal to or greater than the melting temperature, the at least one heating element being encapsulated with the bonding material or provided at the first joining surface. The bonding material being a transition polymer. -The bonding material is provided with a foaming agent, preferably within the bonding material, wherein the foaming agent has an activation temperature so that the foaming agent can be activated by the heat generated by the heating element in the bonding material during the molten phase. The present invention also proposes a coupling assembly comprising such a coupling element and a first substrate assembled on the first joining surface, and a method of obtaining a such a coupling assembly comprising the steps of adjoining the first substrate on the coupling element and providing energy to the at least one heating element to cause the heating of the bonding material up to the melting temperature.