Bonding wood composites with resin solids-fortified phenol-formaldehyde resin

602576 Disclosed is an adhesive binder formulation comprising a fluid mixture of an aqueous phenol-formaldehyde resole resin liquid and a powdered phenol-formaldehyde resole resin, wherein the powdered phenol-formaldehyde resole resin is dispersed in the aqueous phenol-formaldehyde resole resin liqu...

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Hauptverfasser: KENNEDY HERBERT J, KNIGHT JAMES H, YEAGER DANIEL C, BREHMER JR. HARMON E, BREYER ROBERT A
Format: Patent
Sprache:eng
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Zusammenfassung:602576 Disclosed is an adhesive binder formulation comprising a fluid mixture of an aqueous phenol-formaldehyde resole resin liquid and a powdered phenol-formaldehyde resole resin, wherein the powdered phenol-formaldehyde resole resin is dispersed in the aqueous phenol-formaldehyde resole resin liquid, wherein the powdered phenol-formaldehyde resole resin is in an amount of from 0.2 to 10% by weight. Further disclosed is a method of making a wood composite (such as oriented strand board (OSB), plywood, laminated veneer lumber (LVL), waferboard, particleboard, medium density fiber board and hardboard) comprising applying an adhesive binder formulation to wood substrates, wherein the adhesive binder formulation comprises a fluid mixture of an aqueous phenol-formaldehyde resole resin liquid and a powdered phenol-formaldehyde resole resin, wherein the powdered phenol-formaldehyde resole resin is dispersed in the aqueous phenol-formaldehyde resole resin liquid, wherein the powdered phenol-formaldehyde resole resin is in an amount of from 0.2 to 10% by weight, and consolidating the wood substrates with the applied the adhesive binder formulation under conditions to produce the wood composite.