WATER CURABLE RESIN FORMULATIONS

Patent No. 600175 Disclosed is a water curable resin formulation comprising: a. an epoxy resin; b. an aromatic amine curing agent, wherein the molar ratio of amine functional groups in said curing agent relative the epoxy functional groups of said epoxy resin is in the range of 7:10 to 9:10, and whe...

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Hauptverfasser:	WOOD, COLIN, DAVID, TIAN, WENDY, WENJUN, KOZIELSKI, KAREN, ANNE, LEONG, KOK, HOONG, GAO, SONG, HODGKIN, JONATHAN, HOWARD, LEONG, YIN, LIONG
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Zusammenfassung:	Patent No. 600175 Disclosed is a water curable resin formulation comprising: a. an epoxy resin; b. an aromatic amine curing agent, wherein the molar ratio of amine functional groups in said curing agent relative the epoxy functional groups of said epoxy resin is in the range of 7:10 to 9:10, and wherein said aromatic amine curing agent is a monocyclic aromatic amine; and c. a coupling agent comprising a siloxane group coupled to an epoxy reactive group.