Method and composition for removing sodium-containing material from microcircuit substrates

An organic solvent-containing composition and its use by the application to surfaces, for inhibiting adsorption of sodium to integrated circuit surfaces during photoresist removal or post-metal etch cleanup is disclosed, wherein the composition comprises: 1,2-diaminocyclohexanetetracarboxylic acid (...

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Bibliographische Detailangaben
1. Verfasser:	SCHWARTZKOPF, GEORGE
Format:	Patent
Sprache:	eng
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY CINEMATOGRAPHY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FATTY ACIDS THEREFROM HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	An organic solvent-containing composition and its use by the application to surfaces, for inhibiting adsorption of sodium to integrated circuit surfaces during photoresist removal or post-metal etch cleanup is disclosed, wherein the composition comprises: 1,2-diaminocyclohexanetetracarboxylic acid (CYDTA), from 1-50% of a nucleophilic amine, and a non-nitrogen containing weak acid. Wherein the weak acid has a pK value of 2 or greater is in an amount sufficient to partially neutralize the nucleophilic amine such that the composition has an aqueous pH 9.6-10.9; the solvent is a stripping solvent system having a solubility of 8-15% and is present in an amount of 50-98% by weight of the composition.