Circular stripline package incorporating a MMIC low noise amplifier

The specification relates to amplifiers for use in missile receivers. More particularly it relates to a circular low noise amplifier package comprising a circular stripline package incorporating a MMIC low noise amplifier that significantly improves the sensitivity of such missile receivers. Specifically provided is a circular low noise amplifier package that has an X-band MMIC low noise amplifier mounted in an X-band circular microwave package, particularly adapted for use with an existing stripline receiver board employed in a missile. The package has three input/output ports, symmetrically located around the package. The package mounts directly into an existing stripline circuit board as a drop-in replacement for an existing isolator. The circular low noise amplifier package comprises a circular top lid or cover, a circular upper RF gasket, a circular Kovar package lid, a circular hermetic low noise amplifier module, a circular lower RF gasket, and a circular bottom lid or cover. The circular hermetic low noise module has 12 mil feedthrough pins that are coupled to a low noise amplifier chip contained therein. The top and bottom covers are used to mechanically secure the circular low noise amplifier package to the stripline receiver board. The upper and lower RF gaskets are used to improve the RF ground. The Kovar lid is seam sealed to the low noise amplifier package to provide a hermetic seal for the circular low noise amplifier package.