HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES

Microelectronic assemblies fabricated using hybrid manufacturing, as well as related devices and methods, are disclosed herein. As used herein, "hybrid manufacturing" refers to fabricating a microelectronic assembly by arranging together at least two IC structures 5 fabricated by different manufacturers, using different materials, or different manufacturing techniques. For example, a microelectronic assembly may include a first IC structure that includes first interconnects and a second IC structure that includes second interconnects, where at least some of the first and second interconnects may include a liner and an electrically conductive fill material, and where a material composition of the liner/ electrically conductive fill 10 material of the first interconnects may be different from a material composition of the liner/ electrically conductive fill material of the second interconnects.