Method and system for pre-conditioning a mould cavity of a mould for encapsulating electronic components

The present invention relates to a method for pre-conditioning a mould cavity of a mould for encapsulating electronic components, comprising providing a mould comprising a mould cavity and at least one mould cavity opening, and injecting a pre-conditioning gas in the mould cavity through the at leas...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WILHELMUS GERARDUS JOSEPH GAL, ALBERTUS FRANCISCUS GERARDUS VAN DRIEL, JOANNES LEONARDUS JURRIAN ZIJL, JAN ROELOFSEN, SEBASTIANUS HUBERTUS MARIA KERSJES
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention relates to a method for pre-conditioning a mould cavity of a mould for encapsulating electronic components, comprising providing a mould comprising a mould cavity and at least one mould cavity opening, and injecting a pre-conditioning gas in the mould cavity through the at least one mould cavity opening. Wherein a ratio between a total volume of the pre-conditioning gas and a total volume of the mould cavity is at least 1:1, and wherein at least part of the mould surrounding the mould cavity has a temperature different from a temperature of the pre-conditioning gas prior to injecting the pre-conditioning gas in the mould cavity. The present invention further relates to a system for pre-conditioning a mould cavity.