MICROELECTRONIC STRUCTURES INCLUDING GLASS CORES

MICROELECTRONIC STRUCTURES INCLUDING GLASS CORES

[194] Disclosed herein are microelectronic structures including glass cores, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a glass core having through-glass vias (TGVs) therein; a metallization region at a first face of the glass core, wherei...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GANG DUAN, SRINIVAS V. PIETAMBARAM, SAI VADLAMANI, BHARAT PRASAD PENMECHA, TAREK A. IBRAHIM
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:[194] Disclosed herein are microelectronic structures including glass cores, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a glass core having through-glass vias (TGVs) therein; a metallization region at a first face of the glass core, wherein a conductive pathway in the first metallization region is conductively coupled to at least one of the TGVs; a bridge component in the metallization region; a first conductive contact at a face of the metallization region, wherein the first conductive contact is conductively coupled to the conductive pathway; and a second conductive contact at the face of the metallization region, wherein the second conductive 10 contact is conductively coupled to the bridge component.