MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

The present invention relates to a microelectronic assembly, comprising: a substrate having first conductive contacts and second conductive contacts at a face of the substrate; a first microelectronic component having third conductive contacts and fourth conductive contacts at a face of the first mi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OMKAR G. KARHADE, SAIRAM AGRAHARAM, NITIN A. DESHPANDE, XIAOXUAN SUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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