MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

The present invention relates to a microelectronic assembly, comprising: a substrate having first conductive contacts and second conductive contacts at a face of the substrate; a first microelectronic component having third conductive contacts and fourth conductive contacts at a face of the first microelectronic component; a second microelectronic component having fifth conductive contacts and sixth conductive contacts at a face of the second microelectronic component; and a bridge component having seventh conductive contacts and eighth conductive contacts at a face of the bridge component, wherein the fourth conductive contacts are coupled to the seventh conductive contacts, the sixth conductive contacts are coupled to the eighth conductive contacts, the seventh conductive contacts have a smaller pitch than the first conductive contacts, and the eighth conductive contacts have a smaller pitch than the second conductive contacts. The present invention further relates to microelectronic structures including bridges, as well as related assemblies and methods.