Cleaning unit for a mould for encapsulating electronic components, moulding system and method for encapsulating electronic components
The present invention relates to a cleaning unit for a mould for encapsulating electronic components, with a back and forth moveable carriage; an elongated 5 extraction space perpendicular to the moveability of the carriage; elongated skirts parallel to the elongated extraction space; and a suction...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The present invention relates to a cleaning unit for a mould for encapsulating electronic components, with a back and forth moveable carriage; an elongated 5 extraction space perpendicular to the moveability of the carriage; elongated skirts parallel to the elongated extraction space; and a suction opening in the elongated extraction space; wherein an elongated skirt has two parallel protruding raised edges between which a shielded space is located. The invention also provides a moulding system including such a cleaning unit as well as a method for 10 encapsulating electronic components using such a moulding system. |
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