HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES

HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES

Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die 5 is communicatively coupled t...

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Hauptverfasser: MOZHGAN MANSURI, SAI VADLAMANI, JAMES E. JAUSSI, RAHUL N. MANEPALLI, KEMAL AYGUN, KENNETH BROWN, PRIYANKA DOBRIYAL, ANKUR AGRAWAL, DEBENDRA MALLIK, OMKAR KARHADE, JEREMY ECTON, SUJIT SHARAN, BAI NIE, SURESH V. POTHUKUCHI, DIVYA PRATAP, RAJESH INTI, BRANDON C. MARIN, SUSHEEL JADHAV, SRINIVAS V. PIETAMBARAM, BRYAN K. CASPAR, RAVINDRANATH V. MAHAJAN, KRISTOF DARMAWIKARTA, JASON M. GAMBA, XIAOQIAN LI, ARNAB SARKAR, NITIN DESHPANDE, GANG DUAN, ZHICHAO ZHANG, SAMEER PAITAL
Format: Patent
Sprache:eng
Schlagworte:
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Beschreibung
Zusammenfassung:Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die 5 is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate. 10 Fig 2A