Wafer machining system and wafer machining method

The invention provides a wafer machining system and a wafer machining method for performing appropriate blade machining on a laser-machined groove. The laser machining device machines a groove along a scribe line formed on a surface of a wafer with a laser beam, and acquires misalignment information...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TOMOKI FUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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