Wafer machining system and wafer machining method

The invention provides a wafer machining system and a wafer machining method for performing appropriate blade machining on a laser-machined groove. The laser machining device machines a groove along a scribe line formed on a surface of a wafer with a laser beam, and acquires misalignment information...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	TOMOKI FUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	The invention provides a wafer machining system and a wafer machining method for performing appropriate blade machining on a laser-machined groove. The laser machining device machines a groove along a scribe line formed on a surface of a wafer with a laser beam, and acquires misalignment information indicating misalignment of the groove with respect to the scribe line by capturing an image of a surface of the wafer, and stores the misalignment information in a storage unit in association with wafer-specific information. The blade dicing device acquires misalignment information associated with the wafer- specific information of the wafer on which the groove has been formed from the storage unit, and cuts the wafer on which the groove has been formed, along the groove with the blade based on the acquired misalignment information.