APPARATUS FOR AND METHOD OF IN SITU CLAMP SURFACE ROUGHENING

APPARATUS FOR AND METHOD OF IN SITU CLAMP SURFACE ROUGHENING

Disclosed is a dedicated roughening substrate provided With abrasive element useful for in situ roughening of a surface of a clamp in a semiconductor photolithography apparatus. Also disclosed is a method of using the roughening substrate in which the roughening substrate is loaded, positioned oppos...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: ENRICO ZORDAN
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Beschreibung
Zusammenfassung:Disclosed is a dedicated roughening substrate provided With abrasive element useful for in situ roughening of a surface of a clamp in a semiconductor photolithography apparatus. Also disclosed is a method of using the roughening substrate in which the roughening substrate is loaded, positioned opposite the clamp, and then pressed against the clamp and moved laterally.