Mould half and mould method for encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such

The present invention relates to a mould half for a mould for encapsulating electronic components mounted on a carrier, wherein the mould part to support the carrier has a contact surface that comprises a primary carrier support surface and a the primary carrier support surface surrounding secondary...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WILHELMUS GERARDUS JOZEF GAL, ALBERTUS FRANCISCUS GERARDUS VAN DRIEL
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention relates to a mould half for a mould for encapsulating electronic components mounted on a carrier, wherein the mould part to support the carrier has a contact surface that comprises a primary carrier support surface and a the primary carrier support surface surrounding secondary surface, which surrounding secondary surface is supported by a drive for height adjustment of the secondary surface relative to the height of the primary carrier support surface. Such mould half may be used for transfer moulding of electronic components while relatively easy providing a levelled support for the carrier and compensating for any thickness variations in the carrier. The invention also provides a mould with at least two mould parts and a method for encapsulating electronic components mounted on a carrier using such a mould.