ALIGNMENT MARK RECOVERY METHOD, LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD

The invention relates to a method for recovering alignment marks in a mark layer of a substrate, comprising the steps of: a) providing a substrate with a mark layer covered by a resist layer; b) forming alignment marks in the mark layer, wherein an alignment mark is formed by: - exposing the resist...

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Hauptverfasser:	CAYETANO SANCHEZ-FABRES COBALEDA, SANJAYSINGH LALBAHADOERSING
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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creator	CAYETANO SANCHEZ-FABRES COBALEDA SANJAYSINGH LALBAHADOERSING
description	The invention relates to a method for recovering alignment marks in a mark layer of a substrate, comprising the steps of: a) providing a substrate with a mark layer covered by a resist layer; b) forming alignment marks in the mark layer, wherein an alignment mark is formed by: - exposing the resist layer to a patterned radiation beam thereby forming an alignment pattern in a mark area of the resist; c) forming one or more recovery marks in the mark layer, wherein a recovery mark is formed by: - exposing the resist layer to at least a portion of the patterned radiation beam thereby forming an alignment pattern in a mark area of the resist; and - subsequently exposing the mark area of the resist, each time with a shifted patterned radiation beam until a substantial part of the mark area has been exposed.
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b) forming alignment marks in the mark layer, wherein an alignment mark is formed by: - exposing the resist layer to a patterned radiation beam thereby forming an alignment pattern in a mark area of the resist; c) forming one or more recovery marks in the mark layer, wherein a recovery mark is formed by: - exposing the resist layer to at least a portion of the patterned radiation beam thereby forming an alignment pattern in a mark area of the resist; and - subsequently exposing the mark area of the resist, each time with a shifted patterned radiation beam until a substantial part of the mark area has been exposed.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180214&DB=EPODOC&CC=NL&NR=2019151A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180214&DB=EPODOC&CC=NL&NR=2019151A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CAYETANO SANCHEZ-FABRES COBALEDA</creatorcontrib><creatorcontrib>SANJAYSINGH LALBAHADOERSING</creatorcontrib><title>ALIGNMENT MARK RECOVERY METHOD, LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD</title><description>The invention relates to a method for recovering alignment marks in a mark layer of a substrate, comprising the steps of: a) providing a substrate with a mark layer covered by a resist layer; 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subjects	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
title	ALIGNMENT MARK RECOVERY METHOD, LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD
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