METHOD AND DEVICE FOR ALIGNING A FIRST SUBSTRATE WITH A SECOND SUBSTRATE

The invention relates to a method for aligning a first substrate, in particular a mask, with a second substrate, in particular a wafer, comprising: inserting the first substrate and the second substrate into a positioning means; capturing at least one joint image of the first substrate and the secon...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KATRIN SCHINDLER
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention relates to a method for aligning a first substrate, in particular a mask, with a second substrate, in particular a wafer, comprising: inserting the first substrate and the second substrate into a positioning means; capturing at least one joint image of the first substrate and the second substrate; displaying the image; a plurality of image points in the image being marked by a user; and determining a control command for actuating the positioning means on the basis of the marked image points, in such a way that the substrates are aligned with one another.