A chemical vapour deposition apparatus and use thereof
The plasma-enhanced chemical vapour deposition (PECVD) apparatus comprises a tubular chamber (100) configured for a wafer boat (10) with substrates. The PECVD apparatus further comprises heating means (110) arranged at an outside of the chamber and configured for emitting heat by means of radiation,...
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creator | MALCOLM JOHN HARRIS PETER ROELF VENEMA MARTEN RONALD RENES JOHANNES REINDER MARC LUCHIES |
description | The plasma-enhanced chemical vapour deposition (PECVD) apparatus comprises a tubular chamber (100) configured for a wafer boat (10) with substrates. The PECVD apparatus further comprises heating means (110) arranged at an outside of the chamber and configured for emitting heat by means of radiation, and a controller for controlling a state inside the chamber (100), including temperature and composition. Herein, the heating means (110) are configured for the provision of radiation according to a radially varying profile within the chamber, which radial heating profile comprises a first radial zone (I) and a second radial zone (II), and wherein a heat flux (FI) in the first radial zone (I) is higher than the heat flux (FII) in the second radial zone. |
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The PECVD apparatus further comprises heating means (110) arranged at an outside of the chamber and configured for emitting heat by means of radiation, and a controller for controlling a state inside the chamber (100), including temperature and composition. Herein, the heating means (110) are configured for the provision of radiation according to a radially varying profile within the chamber, which radial heating profile comprises a first radial zone (I) and a second radial zone (II), and wherein a heat flux (FI) in the first radial zone (I) is higher than the heat flux (FII) in the second radial zone.</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180410&DB=EPODOC&CC=NL&NR=2017558B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180410&DB=EPODOC&CC=NL&NR=2017558B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MALCOLM JOHN HARRIS</creatorcontrib><creatorcontrib>PETER ROELF VENEMA</creatorcontrib><creatorcontrib>MARTEN RONALD RENES</creatorcontrib><creatorcontrib>JOHANNES REINDER MARC LUCHIES</creatorcontrib><title>A chemical vapour deposition apparatus and use thereof</title><description>The plasma-enhanced chemical vapour deposition (PECVD) apparatus comprises a tubular chamber (100) configured for a wafer boat (10) with substrates. 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The PECVD apparatus further comprises heating means (110) arranged at an outside of the chamber and configured for emitting heat by means of radiation, and a controller for controlling a state inside the chamber (100), including temperature and composition. Herein, the heating means (110) are configured for the provision of radiation according to a radially varying profile within the chamber, which radial heating profile comprises a first radial zone (I) and a second radial zone (II), and wherein a heat flux (FI) in the first radial zone (I) is higher than the heat flux (FII) in the second radial zone.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | A chemical vapour deposition apparatus and use thereof |
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