WERKWIJZE EN INRICHTING VOOR HET MET BEHULP VAN EEN REDUCTIE-MATERIAAL DAT EEN FASEOVERGANG ONDERGAAT OMHULLEN VAN ELEKTRONISCHE COMPONENTEN

The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) placing an electronic component for encapsulating into a mould cavity connecting to the carrier, B) filling the mould cavity with liquid encapsulating material, and...

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Bibliographische Detailangaben
Hauptverfasser:	ZIJL JOANNES LEONARDUS JURRIAN, GAL WILHELMUS GERARDUS JOZEF
Format:	Patent
Sprache:	dut
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) placing an electronic component for encapsulating into a mould cavity connecting to the carrier, B) filling the mould cavity with liquid encapsulating material, and C) at least partially curing the encapsulating material in the mould cavity A reduction material is introduced during processing step B). Said material undergoes a phase change during processing step B) whereby the volume of the reduction material decreases. The invention also relates to a device for applying this method.