Werkwijze voor het aanbrengen van een dunnefilm-encapsulatielaagsamenstel op een organisch device en een organisch device voorzien van een dunnefilm-encapsulatielaagsamenstel bij voorkeur aangebracht met een dergelijke werkwijze
A method for applying a thin-film encapsulation layer assembly to an organic device, which comprises a substrate which is provided with an active stack and is then provided with the thin-film encapsulation layer assembly for screening the active stack substantially from oxygen and moisture, wherein...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | dut |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A method for applying a thin-film encapsulation layer assembly to an organic device, which comprises a substrate which is provided with an active stack and is then provided with the thin-film encapsulation layer assembly for screening the active stack substantially from oxygen and moisture, wherein the thin-film encapsulation layer assembly is formed by applying at least one organic and at least one inorganic layer applied with PECVD or reactive sputtering, onto the active stack, wherein after application of a first organic layer a metal layer is applied to the first organic layer before an inorganic layer is applied thereto utilizing PECVD or reactive sputtering, wherein the metal layer is applied utilizing a deposition technique that causes relatively little radiation, wherein the metal layer protects the organic layer against radiation upon a subsequent PECVD or reactive sputtering process step for applying an inorganic layer. The invention also relates to an organic device manufactured with such a method. |
---|