LEAD-FRAME STRUCTURE, LEAD-FRAME, SURFACE MOUNT ELECTRONIC DEVICE AND METHODS OF PRODUCING SAME

In order to provide a more reliable and cost-efficient way of producing lead-frames or lead- frames structures (100) which expose treated silver surfaces as well as to provide surface mount electronic devices using such lead-frames or lead-frames structures (100), a method comprising the following m...

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Bibliographische Detailangaben
Hauptverfasser:	Dr. Jurgen Barthelmes, DIN-GHEE NEOH
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	In order to provide a more reliable and cost-efficient way of producing lead-frames or lead- frames structures (100) which expose treated silver surfaces as well as to provide surface mount electronic devices using such lead-frames or lead-frames structures (100), a method comprising the following method steps carried out in this order is provided: (a) providing a lead-frame body structure having two main sides, said lead-frame body structure exclusively exposing a copper surface (150) on each one of said main sides; (b) depositing a silver coating on at least one of said main sides, so that said at least one of said main sides at least partially exposes an untreated silver surface; and (c) electrolytically treating said untreated silver surface on said at least one of said main sides generated in method step (b) with a treatment solution containing at least one hydroxide compound selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the lead-frame body structure is a cathode, thereby producing a lead-frame structure (100) which comprises at least two lead-frame entities (110) each one having two faces and at least partially exposing said treated silver surface; wherein said at least one of said two faces of at least one of said lead-frame entities (110) either exclusively exposes said treated silver surface or wherein said at least one of said two faces of said at least one of said lead-frame entities (110) partially exposes said treated silver surface and partially exposes said copper surface (150), wherein, on each one of said two faces of each one of said lead-frame entities (110) which partially exposes said treated silver surface, the area of said copper surface (150) is smaller than the area of said treated silver surface. (Fig. 6)