ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM USING THE SAME

There is provided an electrically conductive adhesive film which can be suitably used as an electrically conductive bonding material for bonding a semiconductor chip (particularly a power device) onto an element-supporting part of a lead frame or onto a circuit electrode part of an insulating substrate, for example, and which is capable of forming, between the semiconductor chip and the element-supporting part of a lead frame or the circuit electrode part of an insulating substrate, a bonding layer that has particularly excellent electrical conductivity and excels both in heat resistance after bonding and sintering and in mounting reliability while being lead-free, and a dicing-die bonding film using the same. The electrically conductive adhesive film of the present invention comprises a metal particle (P), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (Ml), and the metal particle (P) has an average particle size (d50) of 20 ?m or less and comprise 10 % by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.