METHOD FOR DEPOSITING MATERIALS ON A SUBSTRATE
A material deposition system for depositing material on an electronic substrate (12) includes a frame, a support coupled to the frame and configured to support an electronic substrate (12) during a deposit operation, a gantry (38) coupled to the frame, and a deposition head (36) coupled to the gantr...
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creator | TRACY, Robert W KARLINSKI, Thomas J CROUCH, Kenneth C REID, Scott A |
description | A material deposition system for depositing material on an electronic substrate (12) includes a frame, a support coupled to the frame and configured to support an electronic substrate (12) during a deposit operation, a gantry (38) coupled to the frame, and a deposition head (36) coupled to the gantry (38). The deposition head (36) is movable over the support by movement of the gantry (38). The deposition head (36) includes a chamber (1110) configured to hold material, an actuator configured to push a volume of material out of the chamber (1110), a needle (120) extending from the chamber (1110) and terminating in a needle orifice, and at least two air jets (140, 150) located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets (140, 150) produce a timed pulse of air to create a micro-droplet (170a) from the desired volume and to accelerate the micro-droplet (170a) to high velocity. Other embodiments of the material deposition system and method of dispensing are further disclosed. |
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The deposition head (36) is movable over the support by movement of the gantry (38). The deposition head (36) includes a chamber (1110) configured to hold material, an actuator configured to push a volume of material out of the chamber (1110), a needle (120) extending from the chamber (1110) and terminating in a needle orifice, and at least two air jets (140, 150) located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets (140, 150) produce a timed pulse of air to create a micro-droplet (170a) from the desired volume and to accelerate the micro-droplet (170a) to high velocity. Other embodiments of the material deposition system and method of dispensing are further disclosed.</description><language>eng</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CORRECTION OF TYPOGRAPHICAL ERRORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINING MACHINES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PRINTING ; SELECTIVE PRINTING MECHANISMS ; SPRAYING OR ATOMISING IN GENERAL ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230103&DB=EPODOC&CC=MY&NR=195025A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230103&DB=EPODOC&CC=MY&NR=195025A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TRACY, Robert W</creatorcontrib><creatorcontrib>KARLINSKI, Thomas J</creatorcontrib><creatorcontrib>CROUCH, Kenneth C</creatorcontrib><creatorcontrib>REID, Scott A</creatorcontrib><title>METHOD FOR DEPOSITING MATERIALS ON A SUBSTRATE</title><description>A material deposition system for depositing material on an electronic substrate (12) includes a frame, a support coupled to the frame and configured to support an electronic substrate (12) during a deposit operation, a gantry (38) coupled to the frame, and a deposition head (36) coupled to the gantry (38). The deposition head (36) is movable over the support by movement of the gantry (38). The deposition head (36) includes a chamber (1110) configured to hold material, an actuator configured to push a volume of material out of the chamber (1110), a needle (120) extending from the chamber (1110) and terminating in a needle orifice, and at least two air jets (140, 150) located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets (140, 150) produce a timed pulse of air to create a micro-droplet (170a) from the desired volume and to accelerate the micro-droplet (170a) to high velocity. 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The deposition head (36) is movable over the support by movement of the gantry (38). The deposition head (36) includes a chamber (1110) configured to hold material, an actuator configured to push a volume of material out of the chamber (1110), a needle (120) extending from the chamber (1110) and terminating in a needle orifice, and at least two air jets (140, 150) located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets (140, 150) produce a timed pulse of air to create a micro-droplet (170a) from the desired volume and to accelerate the micro-droplet (170a) to high velocity. Other embodiments of the material deposition system and method of dispensing are further disclosed.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING SELECTIVE PRINTING MECHANISMS SPRAYING OR ATOMISING IN GENERAL STAMPS TRANSPORTING TYPEWRITERS |
title | METHOD FOR DEPOSITING MATERIALS ON A SUBSTRATE |
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