METHOD FOR DEPOSITING MATERIALS ON A SUBSTRATE

A material deposition system for depositing material on an electronic substrate (12) includes a frame, a support coupled to the frame and configured to support an electronic substrate (12) during a deposit operation, a gantry (38) coupled to the frame, and a deposition head (36) coupled to the gantr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TRACY, Robert W, KARLINSKI, Thomas J, CROUCH, Kenneth C, REID, Scott A
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A material deposition system for depositing material on an electronic substrate (12) includes a frame, a support coupled to the frame and configured to support an electronic substrate (12) during a deposit operation, a gantry (38) coupled to the frame, and a deposition head (36) coupled to the gantry (38). The deposition head (36) is movable over the support by movement of the gantry (38). The deposition head (36) includes a chamber (1110) configured to hold material, an actuator configured to push a volume of material out of the chamber (1110), a needle (120) extending from the chamber (1110) and terminating in a needle orifice, and at least two air jets (140, 150) located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets (140, 150) produce a timed pulse of air to create a micro-droplet (170a) from the desired volume and to accelerate the micro-droplet (170a) to high velocity. Other embodiments of the material deposition system and method of dispensing are further disclosed.