ROUGHENED COPPER FOIL, CARRIER-ATTACHED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED WIRING BOARD

A roughened copper foil (110) is provided that has a low roughness suitable for formation of a fine circuit and can provide a laminate with a surface profile that can achieve not only high etching properties of an electroless copper plating layer (115) and high resolution of a dry film (116) pattern...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IIDA Hiroto, MATSUDA Mitsuyoshi, KATO Tsubasa, YOSHIKAWA Kazuhiro, TAKANASHI Akitoshi
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
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